The raw materials we produce can well meet the production and making of PEEK Combs.
Thermal Management: Taking advantage of PEEK's good thermal conductivity, combs are designed for thermal management, such as for use in heat sinks or other applications in high temperature environments.
Lightweight design: PEEK is a relatively lightweight material, suitable for designs that need to reduce structural weight. Lightweight PEEK Combs
Mechanical properties: PEEK exhibits excellent mechanical strength and rigidity, allowing it to provide good support and durability in structural parts.
Machining of Holes and Grooves: Depending on the design, it may be necessary to machine holes and grooves on the Wafer Clip to ensure good wafer holding performance.
Quality Control: Quality control is performed at all stages of the production process to ensure that the product meets specifications and design requirements.
Precision machining: PEEK material is easy to process and can produce fixtures that meet design requirements through high-precision machining processes. This is very important for making precision wafer clips to ensure the accuracy of clamping the wafer
High-temperature stability: PEEK materials can maintain stability in high-temperature environments, which is very important for high-temperature processes in the semiconductor industry. Wafer Clips may need to operate at high temperatures in semiconductor production, so PEEK's high temperature stability makes it a suitable choice.